Both smartphones and mobile chips have a very fast development speed. Just weeks ago, MediaTek has confirmed the release of Helio X20 (MT6797) and Helio X25 (MT6797T) in China for Chinese smartphone makers. And the first MT6797T was confirmed to be Meizu Pro 6, which has not yet been in massive production line. Rumors about the new chip, Helio X30, spread out online with this chip’s specs revealed.
According to new sources and Chinese media reports, the next MediaTek processor that the Taiwanese company hope to dominate with is the rumored Helio X30, a successor to the Helio X20 MT6797 and Helio X25 MT6797T which only officially launched earlier this month. It is said that the MediaTek Helio X30 will be manufactured by TSMC with a new TSMC 10nm FinFET manufacturing process.
The MediaTek Helio X30 will still uses deca-core architecture CPU as MediaTek Helio X20 MT6797, but there will be four clusters: 4 x Cortex-A72 cores running at 2.5 GHz, 2 x Cortex-A72 cores running at 2.0 GHz, 2 x Cortex-A53 cores running at 1.5 GHz and 2 x Cortex-A35 cores running at 1.0 GHz. Comparing with the MediaTek Helio X20 MT6797 with tri-cluster of 2x Cortex-A72 at 2.5GHz, 4x Cortex-A53 at 2.0GHz, 4x Cortex-A53 at 1.4GHz, the CPU of MediaTek Helio X30 adds two cores of high clock speed at 2.5GHz, and replace two cores of Cortex-A53 at 2.0GHz with two cores of Cortex-A72 cores at 2.0GHz. See the top deca-core smartphones list.
The changes should cause an increase in performance and decrease in power consumption. So sources say we might see power consumption drop by as much as 50% in MediaTek Helio X30 compared to the MediaTek Helio X20 MT6797 and MediaTek Helio X25 MT6797T. See the first MT6797T Helio X25 smartphone Meizu Pro 6 review and second MT6797T Helio X25 smartphone LeEco Le 2 benchmarks.
It is also rumored that the MediaTek Helio X30 should bring a powerful 4-core PowerVR 7XT GPU and support 26MP snappers, dual camera setups for dual camera smartphones, VR connections, and LTE Cat.13.
And below are the specs and benchmarks list of MediaTek Helio X30:
- Deca-cores SoC chip: 4 x Cortex-A72 cores at 2.5 GHz / 2 x Cortex-A72 cores at 2.0 GHz / 2 x Cortex-A53 cores at 1.5 GHz / 2 x Cortex-A35 cores at 1.0 GHz
- 2 x LPDDR4 RAM ePOP (indicating that the SoC will be an ‘all in on package’)
- Up to 4 GB eMMC 5.1
- ARM Mali-T880
- Support up to a 40 MP rear camera sensor (that can record videos at that resolution at a steady 24 FPS)